Driving on the Technology Highway of Hong Kong
Free Seminar -
October Section
To
focus and stimulate technology transfer and development of
respective critical components industries in Optics, Mechanical,
Electronics, Magnetic, Chemical and Environmental Engineering
and IT,
TechMart of Hong Kong Productivity Council
is
liaising with Hong Kong
Critical Components Manufacturers Association (HKCCMA), America
Hong Kong Electronics Association (AHKEA) and Hong Kong
Optoelectronics Association (HKOEA) to support and
serve the role to foster technology exchange, transfer and
commercialization of respective critical components industries
between Hong Kong, China and overseas.
TechMart joins with HKCCMA, AHKEA and HKOEA to organize and
provide a series of monthly free seminars scheduled on Monday,
the second week of each month.
The
coming event will be
organized as
below:
Date: Oct 13, 2003 Monday
Time: 3:30 pm -
5:00 pm
Venue:
TechMart Theme Hall, LG1 of HKPC Building, 78 Tat Chee Avenue,
Kowloon Tong, Hong Kong
Seminar
Title : LTCC Technology for High Speed
and High Frequency Products
Guest Speaker: Prof. Ke-Li Wu, Dept. of Electronic Engineering,
CUHK
LTCC is a
fast developing system integration and packing technology that
offers an optimal solution to high speed and high frequency
products. The three major aspects that decisively affect the
performance, size and cost of a commercial product today are
package, interconnect and discrete passives. LTCC has a distinct
advantage in packaging in that it provides a harmonic bed for
ICs (digital and analog), embedded passives and accessories
including antennas. LTCC also has proven consistent Coefficient
of Thermal Expansion with ICs. As far as interconnect is
concerned, LTCC offers the capability of fine pitch on each
layer, up to 50 layers (as illustrated).
Since each layer is processed individually, LTCC is much more
cost effective than other sequentially processed technology such
as MCM-D. Furthermore, LTCC provides significant low loss at
high frequency so that microwave circuits of 3-D fashion can be
integrated with control lines and power feed lines within the
same structure. LTCC provides a wider component value range for
passive components and the capability of integrating most, if
not all, passive structures. As a result, it reduces the number
of interconnects, increases reliability, and decreases the
manufacture costs.
In the
presentation, the basic elements of the technology will be
reviewed, from its manufacturing process, to material properties
and RF/microwave performance of typical LTCC modules. Its major
applications for high speed and high frequency product market
will be reviewed. The products are categorized as (i) functional
components for high speed products, (ii)functional components
for high frequency products and (iii) multi-chip modules. A
large number of market product examples will be followed to
display the current market of LTCC products. More examples
related to RF front ends for mobile phones and Bluetooth devices
will be shown.
Since the
most challenge issue in LTCC product designs is the
electromagnetic modeling and optimization, design demonstration
of typical embedded passives will be given. In the end, some of
our current on-going projects will be presented. The projects
include Antenna Switch Module (ASM) for GSM phone, millimeter
wave antenna array, and embedded passives for Bluetooth modules.
Title : Micro-photonics ? tiny pillars for photonic
information processing on a silicon chip
Guest Speaker: Prof. Andrew W. Poon, Department of Electrical
and Electronic Engineering, HKUST
Micro-sized structures fabricated on semiconductor chips can
guide and process photonic information for optical
communications. Light wave can be confined in the semiconductor
photonic structures by total internal reflection, much like
light wave is guided in glass optical fibers. When the
fabricated semiconductor structures are in the form of tiny
pillars, light wave traveling in the pillar cross-section can
form sharp resonance at discrete wavelengths.
In this seminar, we shall discuss the current research work at
HKUST on using micro-pillar optical cavities for photonic
information processing on a single silicon chip. The chips can
be fabricated using standard silicon microelectronic fabrication
processes
Title: Lead-free soldering reliability issues
Guest Speaker: Mr. Daniel Chan, Senior Consultant, ITT unit,
Head of the Reliability and Calibration Centre, HKPC
European Commission has formally adopted two EU Directives in
13th February 2003. Hazardous Substances Directive (RoHS)
requires the phasing out of lead, mercury, cadmium, hexavalent
chromium, Polybrominated biphenyls (PBB) and Polybrominated
diphenyl ethers (PBDE) by 1 July 2006. Designers and
manufacturers will therefore have to find cost-effective and
safe alternatives for these substances. As such, lead-free
soldering issue has become very pressing. Local manufacturers
are advised to adopt lead-free soldering technologies as early
as possible. Lead-free solders available on the market are in
general having tighter process windows. Solder joint reliability
problems are prone to appear in the products of electronics
manufacturers when they switch from conventional tin-lead
eutectic solder to lead-free solder. This talk will give the
manufacturers an awareness on the reliability issues of
lead-free solders.
| Time |
Topic |
|
3:30pm |
Opening |
|
3:35pm - 4:05pm |
LTCC Technology for high speed and high frequency
products
Guest Speaker : Prof. Ke-Li Wu, Dept. of Electronic
Engineering, CUHK
|
|
4:05pm - 4:35pm |
Micro-photonics ? tiny pillars for photonic information
processing on a silicon chip
Guest Speaker : Prof. Andrew W. Poon, Department of
Electrical and Electronic Engineering, HKUST
|
|
4:35pm - 5:00pm |
Lead-free soldering reliability issues
Guest Speaker : Mr. Daniel Chan, Senior Consultant, ITT
unit, Head of the Reliability and Calibration Centre, HKPC
|
|
5:00pm |
Networking Section |
Registration
Please
download the leaflet and
fill in the reply slip and fax back at 2788-5413 on or before
11 October
2003 or by email registration to
brenda@hkpc.org. For enquiry, please contact Ms Brenda Lee
at 2788-5912.
Organizer:
Co-organizers
|
|
|
|
