Mr. Lam is the President and COO of the Lafe Technology Limited, a listed company in the Singapore Stock Exchange. He is also the Vice Chairman of the Hong Kong Critical Components Manufacturers Association. 

Mr. Lam holds a BSC degree in Mechanical Engineering. He has over 30years of experience in the Data Storage Industry, primarily in the design and manufacturing of Magnetic Heads, Head Modules, Hard Disk Drive, Tape Drives, and Autoloaders for Data Storage Systems.